 | DIMA HP110 Hybrid Pick&Place unit
- Placement rate: up to 4600 cph. (IPC rated)
- Components: Chip, Melf, SO, SOT, SOIC, TSOP, TNT, QFP, uBGA, BGA, LCC etc.
- Component size: 0201 (demonstrated) to 42x42mm
- Vision system: ESI Correctplace, Automated board alignment, Full vision component alignment and analysis by vision system, Test on lead pitch, sqew angle, BGA ball count and size.
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SpeedPrint SP200
- Semi-automatic Stencil Printer with Fiducial recognition Camera system
- Capable of fine pitch printing
- Pcb's up to 460 x 510mm, 5mm thickness
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Cosy SMD reflow unit
- Portable for onsite assembly
- 122mm transport belt
- Small PCB proto typing
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Ersa ERS 220 reflow unit
- 200mm transport belt
- 3 controlled heat zones
- 1 add. hot air section
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DIMA Passaat convection unit
- 400mm transport belt
- 4 PC controlled heat zones
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Exmore Easy 500 Vapour-Phase solder unit
- Pcbs size up to 500 x 500mm.
- Inert atmosphere during the whole process.
- Incomparable AT cross the board.
- Pb containing boards can be reflowed at 200 C Max.
- Pb-Free boards can be reflowed at 230 C Max.
- Damaging or rapid aging by overheating the components or boards is not possible.
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ELMA 1040/H PCB cleaning
- 1 Bath with ZESTRON FA. (Spray Under Immersion )
- 2 Baths DEMI water with filter cirquit.
- Memmert drying oven.
- Max. PCB size (l) 360mm x (h) 230mm
ZESTRON FA specs:
- Exellent solvency for all types of flux residues.
- Low surface tension makes it ideal to creep under the tight spaces of BGA and Flip Chips.
- EMPF Phase II tested and MIL. approved.
- Exellent material compatibility.
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Microscope Euromex
- 100 Watt cold light
- stereoscope
- zoom 7x to 45x
- CCD colour camera
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Microscope Dynascope
- 3D vision system
- zoom 6x to 40x
- 250 Watt cold light
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For BGA and leadless components we use a Phoenix nanomex X-Ray unit for inspection
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Westbond DIE and Wire bonder
- Ball/wedge and Wedge/Wedge bonding, Aluminium, Gold and Ribbon wire.
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PCB production in CLEANROOM conditions:
Laminar Flow Workbench.
- Working area 1800mm x 600mm.
- Airflow 0.45m/s.
- ESD protected.
Cleanroom facilities.
- Transition room (pre-cleanroom)
- 2000mm x 2000mm x 2000mm
- clean air shower.
- Vacuum cleaner inlet.
Work area:
- 5000mm x 5000mm x 2500mm.
- Static Conductive computer floor tiles.
- Up to Down clean air flow.
- Room Temp. Control 22 +/- 3°Cel.
- Humidity Control 55 +/- 10 %RH.
- 15 Pa Positive Air Pressure.
- Overhead De-ionizer.
- Static Conductive Benches/Seats/Clothes.
- Metcal and JBC solder stations.
- Assembly and inspection Under Microscope.
- Hunter-Spring tensile tester. (220N max.)
- Voltage drop tester.
We are trained to IPC610C class 3 and ESA Standards (certified) in areas of :
- (ESA PSS-01-708) Conventional Through Hole Assembly and Wire Harness and inspection.
- (ESA PSS-01-738) Surface Mount Technology and inspection.
- (ECSS-Q-70-08 - Cat.2) Repair, modification and inspection.
- (ECSS-Q-70-26) Crimping and inspection.
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